Reliant Deposition Products
Products
Chemical Vapor Deposition (CVD) High-Density Plasma Chemical Vapor Deposition (HDP-CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Pulsed Laser Deposition (PLD) Reliant Systems
Used throughout chip manufacturing, deposition processes lay down a wide range of conducting and insulating materials on the wafer that help form the components and wiring of a semiconductor device. For markets such as micro-electromechanical systems (MEMS) and power devices, the numerous feature shapes and different materials involve additional manufacturing requirements.
Lam’s Reliant® deposition product family enables roadmaps for Specialty Technologies and extends the productive life of fabs.
Industry Challenges
In recent years, the semiconductor industry has expanded to new segments such as power chips, CMOS image sensors (CIS), radio frequency (RF) filters, and micro-electromechanical systems (MEMS) that enable greater connectivity, more powerful imaging, and a host of other market-driven capabilities. Because of the variety of requirements used in their manufacture, deposition technologies must be capable of addressing numerous material and performance needs.
Key Customer Benefits
- Flexibility for addressing a wide range of process requirements enabled by Multi-Station Sequential Deposition (MSSD)
- Enhanced film uniformity across the wafer surface
- Repeatable film properties with excellent stress stability
- High-productivity due to high-throughput and efficient wafer handling design
- Production-proven, low CoO solutions from 150 mm to 300 mm
Product Offerings
- Concept Two® ALTUS® (200 mm)
- Concept Two® SEQUEL® (200 mm, 150 mm)
- Concept Two® SPEED® (200 mm)
- Pulsus™
- SPEED® Max (300 mm)
- VECTOR® (300 mm, 200 mm)
Key Applications
- Chemical vapor deposition (CVD) tungsten
- High-density plasma (HDP)-CVD gap-fill oxide
- Plasma-enhanced CVD (PECVD) silane oxide, nitride, and oxynitride
- PECVD TEOS oxide
- Pulsed Laser Deposition (PLD)
- Doped oxides (boron phosphorous)