Phoenix Product Family

Advanced packaging is becoming an increasingly critical approach to continue scaling beyond silicon. Several device manufacturers and fabless companies are increasing adoption of novel chiplet solutions to meet level performance and cost requirements. This accelerating chiplet transition requires new packaging solutions and innovations in the substrate market segment. As traditional silicon scaling approaches cost and technology limitations, companies are adopting novel chiplet and heterogenous integration solutions. To ensure continued scaling, substrate solutions require several innovations in process equipment solutions. In addition to meeting the technology roadmap needs, substrate level equipment must have increased flexibility to process panels of various materials and sizes. In addition, high productivity and low cost of ownership are desirable for high volume manufacturing environments.