提供精密的測量來洞察製程
質量測量技術可測量晶圓在沉積、蝕刻和清洗製程之後的質量變化，以便能夠監測和控制這些經常重複的核心製造步驟。對於薄膜堆疊，高深寬比結構和複雜3D架構等設計，光學技術在精確測量厚、深或視覺上模糊的特徵結構方面的能力有限。測量這些應用的質量變化提供了一種直接的高精度解決方案，可用來監測和控制先進元件結構中的關鍵特徵，而這些特徵通常是不容許有任何變異的。
Lam Research的高精度質量測量系統提供沉積、蝕刻和清洗步驟的即時線上監測和控制 ─ 記錄質量的微小變化，以對潛在的製程偏差實現先進的檢測。
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