電晶體─亦即晶片的「大腦」─ 是控制電流流向的極小開關，在一顆晶片中可包含高達數十億個電晶體。隨著市場對更小，更強大電子產品的需求，推動了3D FinFET 等新型電晶體架構的發展，並使用高介電值(high-k)/金屬閘等特殊材料。這些新技術和新材料的發展使元件的特徵結構尺寸得以持續微縮。由於現今最新的電晶體尺寸已達到原子級，對製造而言是極大的挑戰。為確保這些先進元件的優異效能，製造功能需提供卓越的精密度與控制，才能形成所需的微小結構。
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